Product Overview
Our high frequency aluminum substrates utilize advanced material formulations-including ceramic-filled PTFE and hydrocarbon resin systems-to achieve exceptional electrical properties while leveraging aluminum's 1-2 W/m·K thermal conductivity for active heat spreading.
Key Parameters
| Parameter | Detailed Specification | |
| Layer Count | Single/double/multi-layer | |
| Base Material | Aluminum Base | |
| Copper Thickness | 0.8mm - 3.0mm | |
| Board Size (Max) | 570mm × 1200mm | |
| Copper Foil Type | RTF/ED copper foill | |
| Operating Temperature |
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| Surface Finishes | ENIG, Immersion Silver, OSP, HASL |
Key Features
Thermal Dissipation
The aluminum core efficiently draws heat away from critical components, significantly lowering operating temperatures
High-Frequency Performance
The aluminum core eliminates hot spots and reduces component junction temperatures by 20-30°C in high-power RF applications.
Enhanced Mechanical Stability
our high-frequency variants maintain stable DK/Df characteristics across -55°C to +150°C temperature ranges.
Cost-Effective High-Volume Production
While initial tooling costs are higher than FR4, the integrated thermal solution reduces overall BOM costs by eliminating external heat sinks and thermal interface materials.
Advantages
| Advantages | Specification |
| Exceptional Heat Management | Directly dissipates heat from high-power components like LEDs, RF amplifiers, and power converters |
| Enhanced Signal Integrity | The low-loss dielectric material ensures that high-frequency signals are transmitted with minimal loss and distortion |
| Improved Product Longevity and Reliability | The PCBs significantly extend the service life of both the board itself and the mounted components |
| Design Versatility | Suitable for a wide range of applications, from high-power lighting to sophisticated RF systems, offering designers a reliable solution for complex thermal and electrical challenges |
Applications
| Field | Application |
| Telecommunications & 5G Infrastructure | 5G/6G Massive MIMO antenna arrays,Remote Radio Units (RRU) and Baseband Units,Small cell power amplifiers with integrated thermal management |
| Aerospace & Defense | Phased array radar systems,Satellite communication transceivers,Electronic warfare (EW) jammers and receivers |
| Automotive Electronics | 77GHz automotive radar for ADAS,LED headlight driver circuits with RF noise suppression,Electric vehicle battery management system (BMS) sensors |
| Industrial & Medical | RF heating equipment for industrial processes,MRI RF coils requiring thermal stability,High-power laser diode drivers |
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| Manufacturing parameters | Capabilities |
| Layers | 1-4 layers standard |
| Base Material | Aluminum core |
| Technology highlights | Aluminum plates and high heat -conducting insulating materials, high thermal conductity, can be used as 8 layer hybrid aluminum substrate |
| Solder mask | Green, red, yellow, blue, white, black, purple, matte black,matte green |
| Aluminum | Standard, high performance, halogen free |
| Surface Finishes | HASL; Lead-Free HASL; ENIG; ENEPIG; Immersion Silver; Immersion Tin; OSP. |
| Solder Mask | Green, Purple, Blue, Red, Yellow, White, Black, custom colors |
| Copper weights(finished) | 0.5 oz - 10.0 oz |
| Minimum track and gap | 0.075mm/ 0.075mm |
| Finish copper weight | 1-10 oz |
| Maximum dimensions | 610mm x 450mm; dependent upon laser dilling machine |
| Board thickness | 0.4-3.2mm |
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