Ningbo MingXi Industry and Trade Co., Ltd, established in 2014, is a leading provider of integrated electronic manufacturing services. Formerly known as Ningbo MingTeHan Electronics Co., Ltd, the company specializes in PCB production and R&D, SMT assembly, DIP assembly, testing, inspection, aging, full product assembly, and wire harness manufacturing.
We specialize in the production of a wide range of electronics, including single side rigid PCB, double sided rigid PCB, multilayer rigid PCB, high frequency rigid PCB, smartphones motherboard PCBA, smart speaker PCBA, standard wire harnesses, gang smart touch Switch, and more.
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![1st Order HDI Boards]()
1st Order HDI Boards1st Order HDI (High-Density Interconnect) incorporate microvias - extremely small interconnection points - that are created using laser drilling technology rather than conventional mechanical...view more -
![2nd Order HDI Boards]()
2nd Order HDI Boards2nd Order HDI Board goes through two separate lamination-and-drilling cycles on each side of the core. The structure looks like this: 2+N+2. Two build-up layers on top, N layers of core in the...view more -
![Any-layer HDI PCB]()
Any-layer HDI PCBAnylayer HDI boards, by supporting interconnections between any layers, achieve extremely high routing density and design flexibility, making them an ideal choice for modern high-density,...view more -
![High Frequency HDI PCB]()
High Frequency HDI PCBHigh Frequency HDI PCBs operate reliably at frequencies from 1 GHz to 100+ GHz while integrating the fine-pitch routing and microvia structures required for modern miniaturized electronics.view more -
![Rigid Flex HDI PCB]()
Rigid Flex HDI PCBRigid Flex HDI PCB represents the pinnacle of printed circuit board technology, integrating three advanced approaches: the stability of rigid boards, the flexibility of flexible circuits, and the...view more
Why Choose us
Rich Experience
Our core team has over 10 years of experience in electronics manufacturing, enabling us to quickly respond to customer needs and provide professional solutions.
Quality Assurance
We adhere to strict international quality standards (such as ISO 9001 and IPC-A-610) to ensure that every product meets the highest customer expectations.
Comprehensive Service Support
From product development, design optimization (DFM), prototyping to mass production, we provide one-stop services to help customers reduce time-to-market.
Parameter
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Manufacturing parameters |
Capabilities |
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Layers |
4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect) |
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Base Material |
FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials |
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Board Thickness |
0.2mm - 6.0mm |
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Copper Thickness |
0.5 oz - 6 oz (17.5μm - 210μm) |
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Minimum Hole Size |
0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias |
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Minimum Trace/Space Width |
2 mils (50μm) for standard HDI, down to 1 mil (25μm) for advanced designs |
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Solder Mask |
LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors |
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Minimum Annular Ring |
2 mils (50μm) for outer layers, 1 mil (25μm) for inner layers |
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Controlled Impedance |
Tolerance of ±10% or better |
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Silkscreen Color |
White, Black, Yellow, and other custom colors |
Customization Process
Communication Needs: Custom colors can be tailored to meet specific customer requirements. Please provide your customization concepts and detailed specifications for further discussion.
Production Execution: Following the confirmed design, we implement meticulous production processes with strict quality control at every stage, ensuring consistency and precision before proceeding to mass production.
Quality Inspection and Packaging: Upon completion of the product, a comprehensive three-stage inspection process is conducted to ensure quality standards are met. Subsequently, the products are packaged in accordance with your specified requirements.
Delivery Assurance: We ensure timely delivery of the products within the agreed timeframe as per the contract terms.
Benefits of HDI PCB
Lightweight and compact sizing
Populating more components on either side of HDI PCBs leads to smaller footprints and lightweight boards with improved functionality.
Low-cost boards
With HDI technology, it is possible to reduce the raw material quantity, number of layers, and even the number of boards, which leads to an overall reduction in cost.
Improved performance and reliability
As components become closer and the number of transistors per unit area is higher, it is clear that the performance is improved in HDI boards. There are fewer signal integrity issues in HDI boards and a significant decrease in crossing delays, signal losses, etc. The use of micro vias over through holes has a remarkable impact on the reliability of the HDI board due to the former’s smaller aspect ratio and high-quality construction.
Enhanced signal Integrity
One of the standout advantages of HDI PCBs is their ability to enhance signal integrity. Signal integrity is crucial for reliable data transmission, especially in high-speed digital applications. These PCBs feature reduced signal distortion and electromagnetic interference (EMI), ensuring that data travels across the board with minimal losses. This results in improved overall system performance and data accuracy.
Improved thermal management
In the ever-increasing world of high-performance electronics, overheating is a common concern. HDI PCBs address this challenge by optimizing thermal management. With their compact designs and advanced material choices, these boards efficiently dissipate heat, preventing overheating-related issues. This is especially critical in applications like gaming consoles, servers, and automotive electronics, where heat dissipation can impact performance and reliability.
Design Considerations for HDI PCBs
Signal integrity: The tighter spacing in HDI PCBs increases susceptibility to crosstalk, impedance discontinuities, and other signal degradation issues. Thorough signal integrity analysis and simulations are crucial.
Thermal management: The high component density of HDI PCBs can lead to heat dissipation challenges. Thermal modeling, via sizing, and dedicated thermal zones must be implemented.
CAD tools: HDI design requires advanced CAD tools capable of handling dense data sets, microvias, buried vias, and other HDI features.
Design for manufacturing (DFM): Close collaboration with the manufacturer’s or supplier’s DFM team is critical. DFM reviews catch potential issues early on, optimizing the design for cost-effective and reliable HDI fabrication.
Shipping and Payment Terms
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Terms Of Payment |
We usually accept T/T, L/C, Paypal, Credit card, etc. If you prefer other payments terms, please feel free to discuss with us. |
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Shipping |
It can be delivered by truck, train, sea, air. |
As one of the leading HDI PCB manufacturers and suppliers in China, we warmly welcome you to buy bulk HDI PCB made in China here from our factory. For customized service, contact us now.
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