Technical Specifications & Production Limits

Parameter	Our Manufacturing Capability	Standard Process	Advanced Process
Total Layer Count	Up to 20 layers (6 flex + 14 rigid)	4-10 layers	12-20 layers
Minimum Line Width/Space	0.035mm (1.4mil) flex / 0.015mm (0.6mil) HDI	0.05mm/0.05mm	0.015mm/0.015mm
Laser Drilled Microvia	0.03mm (1.2mil) diameter, 0.1mm depth	0.05mm diameter	0.03mm diameter
Sequential Lamination Cycles	Up to 6 cycles (HDI buildup)	2-3 cycles	4-6 cycles
Flex Layer Thickness	0.05mm to 0.25mm (single layer)	0.075mm	0.05mm (ultra-thin)
Copper Thickness	12μm (1/3oz) to 70μm (2oz)	18μm (1/2oz)	12μm for dynamic flex
Impedance Tolerance	±8% standard, ±5% controlled	±10%	±5% (measured)
Registration Accuracy	±25μm layer-to-layer (X-ray verified)	±50μm	±25μm

Core Material Stackup Options

Application Type	Flex Layer Material	Rigid Layer Material	Dielectric Thickness	Copper Type
Standard (Cost-Optimized)	Polyimide (PI)	FR-4 High Tg	0.1mm	ED copper
High-Speed Digital	Low-Dk Polyimide	Megtron 6/ITEQ IT-200	0.075mm	RA copper
Dynamic Flexing	Adhesiveless PI	Rigid-flex specific	0.05mm	Rolled Annealed
Thermal Management	Copper-clad PI	Aluminum-core FR-4	0.15mm	Heavy copper (2oz)

Advanced Manufacturing Equipment & Processes

01/

Precision Drilling & Via Formation

UV Laser Drilling: Mitsubishi 6-head laser system, 20μm beam diameter
Mechanical Drilling: Hitachi 6-spindle CNC, 0.1mm minimum mechanical via (stacked/staggered)
Via Filling: Conductive paste (copper) for 0.05mm vias, plated shut for thermal vias
Desmear Process: Plasma etch for high-aspect ratio microvias (8:1 ratio achievable)

02/

Fine-Line Imaging & Etching

LDI (Laser Direct Imaging): Orbotech Nuvogo 1000, 15μm line capability
Exposure: Collimated UV light, vacuum drawdown for flex surface flatness
Etching: Horizontal conveyor, ±0.01mm line width uniformity across panel

03/

Lamination & Bonding

Vacuum Lamination: Burkle 8-opening press, 200°C ±3°C temperature uniformity
Sequential Lamination: 6-cycle capability with 50μm dielectric buildup per cycle
Adhesiveless Bonding: Direct cast polyimide on copper for 10M+ dynamic flex life
Coverlay Application: Photoimageable vs. Polyimide film (25μm to 75μm thickness)

04/

Surface Finishes (In-House)

ENIG: 2-5μ" Au, 120-200μ" Ni (meets IPC-4552)
ENEPIG: 1-2μ" Au, 3-7μ" Pd, 120-200μ" Ni (wire bondable)
Hard Gold: 10-50μ" Au (selective plating for contacts)
OSP: 0.2-0.5μm thickness (lead-free compatible)

Quality Testing & Validation Capabilities

Electrical Testing

Flying Probe: 4-wire Kelvin measurement for critical nets (0.5mΩ resolution)

Fixture Testing: Universal grid test for volume production (0.05mm probe pitch)

Impedance Testing: TDR (Time Domain Reflectometer) on 100% of controlled impedance nets

Hi-Pot Testing: Up to 1000VDC for insulation resistance (medical/aerospace)

Mechanical & Reliability Testing

Flex Endurance: Custom bend tester, 100,000 cycles @ R=5mm, 25°C

Thermal Cycling: -40°C to +125°C, 1,000 cycles (per IPC-TM-650 2.6.7.2)

IST (Interconnect Stress Test): Coupon testing for barrel integrity

Peel Strength: 1.0-1.5 N/mm (adhesiveless), 0.8-1.0 N/mm (adhesive-based)

Inspection & Analysis

AOI: Camtek 8μm resolution, post-etch and pre-lamination inspection

X-ray Inspection: YXLON FF35 CT, 2μm resolution for microvia void detection

Microsectioning: Destructive analysis for 10% of first articles

Ion Contamination: Ionograph testing to <1.0μg/cm² NaCl equivalent

Application Examples with Technical Details

Consumer Electronics - Smartphone Camera Module

Design: 8-layer rigid-flex (4L rigid + 2L flex + 2L rigid)

Features: 0.04mm laser microvias, 0.035mm/0.035mm trace/space, staggered via-in-pad

Mechanical: 0.1mm flex thickness, 180° dynamic bend in hinge area

Volume: 500,000 units/month production capacity

Automotive ADAS - 360° Camera System

Design: 12-layer HDI rigid-flex with buried & blind vias

Material: High-Tg FR-4 (180°C) + adhesiveless polyimide flex

Reliability: Thermal cycling -40°C to +105°C (automotive grade)

Compliance: AEC-Q100 qualification, PPAP documentation available

Medical Devices - Hearing Aid Flex Assembly

Design: 6-layer flex-rigid, 0.3mm total thickness

Density: 0.5mm pitch BGA, 0.03mm microvias, 4mil laser drill pitch

Biocompatibility: ISO 10993 compliant materials, cleanroom assembly option

Traceability: Full batch tracking, 15-year data retention

UAV & Aerospace - Avionics Pod

Design: 16-layer asymmetric rigid-flex, 4 sequential lam cycles

Material: Low-loss Megtron 6 + flex polyimide (3.4 Dk)

Performance: 10Gb/s signal integrity verified to 1 meter flex length

Certifications: AS9100D available, ITAR registered facility

Production Lead Times & Volume Pricing

Order Volume	Standard Lead Time	Expedited Option	Panel Utilization
Prototype (1-5pcs)	7-10 working days	5 days (NO expedite fee)	1-2 panels (prototype pricing)
NPI (50-200pcs)	15 working days	10 days	Standard 18"×24" panel
Low Volume (500-2k pcs)	20-25 working days	15 days	Panel optimization included
High Volume (5k+ pcs)	4-6 weeks	N/A	Dedicated tooling, 95%+ utilization

Monthly Production Capacity: 30,000m² rigid-flex PCBs (across 3 production lines)
2024 On-Time Delivery: 98.5% for standard orders, 96.2% for expedited