Product Overview

Our double-layer flex solutions are manufactured with polyimide (PI) or polyester (PET) substrates, supporting intricate circuit designs with reliable via interconnections. Whether you need a flexible circuit for compact consumer electronics or a reliable interconnect for medical devices, our 2-layer FPC technology provides the performance and durability your application demands.

Key Parameters

Parameter	Detailed Specification
Layer Count	2 conductive layers (double-sided)
Base Material	Polyimide (PI) 25μm-125μm
Copper Thickness	1/3 oz to 2 oz (12 μm - 70 μm)
Minimum Trace Width/Space	0.075mm / 0.075mm
Minimum Drill Hole	0.1mm mechanical drill
Operating Temperature	-40°C to +125°C (standard PI)
Surface Finishes	ENIG, OSP, Immersion Tin/T Silver

Key Features

Enhanced Circuit Density
Double-sided copper construction doubles available routing space, enabling complex circuit patterns in compact footprints

Reliable Interlayer Connection
Our advanced plating process ensures via reliability even under repeated flexing, with crack-resistant copper deposition that meets IPC-6013 Class 3 standards.

Superior Signal Integrity
The dual-layer structure supports dedicated power and ground planes, reducing crosstalk and electromagnetic interference by up to 60% compared to single-layer designs.

Advantages

Advantages	Specification
Optimal Balance of Density and Flexibility	our 2-layer FPCs maintain excellent bend characteristics while delivering the routing complexity needed for modern electronics.
Cost-Saving	Double-layer construction adds only 15-25% cost over single-layer designs, yet provides 100% more routing area and significantly better electrical performance.
Design Freedom	Route signals on both sides, implement copper pours for shielding, and place vias anywhere needed.
Proven Reliability	Double-layer FPCs experience less stress during thermal cycling and bending

Applications

Field	Application
Consumer Electronics	Smartphone hinge circuits, laptop display interconnects, camera module flexes, wearable device antennas, and foldable phone circuits
Medical Devices	Patient monitoring equipment, ultrasound probe assemblies, endoscopic camera modules, and drug delivery systems
Automotive Electronics	Dashboard displays, infotainment touchscreens, 360° camera systems, sensor interconnects, and LED lighting modules
Aerospace & Defense	Avionics displays, satellite communication modules, UAV control systems, and helmet-mounted displays.
Industrial Automation	Robot articulation joints, industrial camera systems, barcode scanners, and motion control feedback loops.
Telecommunications	5G antenna elements, optical transceiver flex circuits, and base station RF modules

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Manufacturing parameters	Capabilities
Layers	1-6 layers/ Above 8 layers
Min Line Width/Spacing	2/2mil
Base Material Thickness	0.025mm-0.2mm
Coverlay Thickness	0.012mm-0.1mm
Min Hole Size	0.1mm
Copper Weight Range	±1mil
Copper Weight Range	0.5oz-2oz
Min Bend Radius	0.3mm
Flex Cycles	>500,000 times