Product Overview

Our multilayer rigid-flex solutions support 4 to 16+ layers, delivering uncompromised signal integrity while reducing interconnect points by up to 70% compared to conventional rigid PCB + cable assemblies.

Key Parameters

Parameter	Detailed Specification
Maximum Layers	Up to 10 layers (rigid-flex)
Board Thickness	0.05mm - 0.8mm (flex areas)
Board Thickness Range	Flexible zones: 0.1–0.3mm; Rigid zones: 0.4–2.0mm
Minimum Line Width/Spacing	0.035mm / 0.035mm
Impedance Control Tolerance	±5% (optimized for high-speed signals)
Finished Copper Thickness	1/3 oz to 2 oz (12–70 μm)
Surface Finishes Available	ENIG, HASL, Immersion Silver, Gold Plating

Key Features

High Reliability
The board minimizes failure points caused by vibration, shock, or repeated movement

Lightweight Construction
Using polyimide films, Rigid Flex PCBs reduce substrate weight by up to 70% compared to traditional rigid boards

Enhanced Signal Integrity
Shortened signal paths between rigid sections improve transmission speed and reduce noise

Advantages

Advantages	Specification
Space Optimization & Weight Reduction	space savings through 3D folding and elimination of connectors and weight reduction compared to rigid board + wire harness assemblies
Enhanced Signal Integrity	Elimination of connector discontinuities reduces signal loss and Lower EMI susceptibility
Superior Reliability & Durability	fewer solder joints reduce failure points ;Excellent vibration resistance and Proven field reliability
Design Versatility	3D assembly capability;Mixed material construction

Applications

Field	Application
Aerospace & Defense	Satellite communication modules,flight control systems
5G & Telecommunications	base station RF modules, optical transceivers,Low-loss signal transmission,
Medical Electronics	Surgical robots, imaging systems (MRI/CT), implantable devices
Automotive & ADAS	Camera modules, radar sensors, engine control units
Consumer Electronics	Foldable smartphones, wearable devices, TWS earbuds, VR/AR headsets

Rigid Flex Multilayer PCB, HDI Rigid Flex, Flexible Printed Circuit, High Density Interconnect, Polyimide PCB, 3D PCB Assembly, Aerospace PCB, Medical Device PCB, 5G PCB, Automotive PCB

Manufacturing parameters	Capabilities
Layers	4 to 40 layers
Base Material	FR-4, High-Tg FR-4, Rogers, PTFE, Polymide, Aluminum substrate, etc.
Min.Line width	0.076mm/3mil
Min.Hole size	0.15mm(mechanical) 0.1mm(laser drilling)
Min.Line spacing	Min.Line spacing
Copper thickness	1oz-3oz
Board thickness	0.2-7.0mm
Finish copper	1-13 oz
Solder mask	White, Black